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Insights The advancement of 3D heterogeneous integration is transforming system-on-chip (SoC) design by enabling the seamless combination of multiple chiplets, including 2D and 2.5D dies, sourced from different fabs and packaging technologies. Cadence Design Systems leads this space by providing an integrated flow for chiplet and 3D-IC designs that serve automotive, data center, and various…
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Insights PsiQuantum has announced a monumental $1 billion Series E funding round, backed by leading investors such as BlackRock, Temasek, and Baillie Gifford, pushing its valuation to $7 billion. This capital will accelerate the company’s development of commercially viable, fault-tolerant quantum computers at a million-qubit scale, a significant engineering challenge the company is uniquely positioned…
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At the recent AI Infrastructure Summit, NVIDIA introduced a groundbreaking paradigm: transforming traditional data centers into highly integrated AI factories. Moving beyond its core chip business, NVIDIA is partnering with major technology and infrastructure companies to co-engineer facilities optimized for the intensive power and cooling demands of AI workloads. This initiative embraces a system-level approach,…
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Insights IBM and AMD have announced a strategic collaboration to develop next-generation computing architectures that integrate quantum computing with high-performance classical computing, termed quantum-centric supercomputing. By combining IBM’s expertise in building world-leading quantum systems with AMD’s powerful CPUs, GPUs, and AI accelerators, the companies aim to create hybrid platforms capable of solving complex problems that…
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Insights Physical AI represents a transformative step in artificial intelligence, shifting focus from digital-only applications to intelligent systems that operate autonomously in the physical world. This emerging technology blends robotics and machine learning to create robots, drones, and autonomous vehicles capable of sensing, processing, and responding to complex environments. A panel of experts at SXSW…
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Intel Announces Leadership Appointments to Strengthen Core Business and Foundry Strategy Intel today announced several senior leadership appointments designed to strengthen its core product business, build a trusted foundry, and foster a stronger engineering culture across the company. The changes position the company to accelerate growth in data center, client computing, and custom silicon. Kevork…
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Synopsys Expands GenAI Copilot Capabilities to Accelerate Chip Design Synopsys announced an expansion of its Synopsys.ai Copilot GenAI capabilities to speed semiconductor design, help handle more complex designs, and boost engineering velocity amid a workforce shortage. The company positions AI as a core element of modern chip design, using reinforcement learning and GenAI to optimize…
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Siemens Unveils AI-Enhanced EDA Toolset at DAC 2025 At DAC 2025 in San Francisco, Siemens Digital Industries Software introduced an AI-enhanced EDA toolset designed to accelerate semiconductor and PCB design workflows. The centerpiece is a purpose-built EDA AI system that combines secure, generative and agentic AI with deep customization and seamless integration across the entire…
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Cadence to Acquire Hexagon’s Design & Engineering Unit to Boost Multiphysics System Design Cadence Design Systems announced a definitive agreement to acquire the Design & Engineering (D&E) business of Hexagon AB, including MSC Software, for about €2.7 billion. The deal funds 70% in cash and 30% in Cadence common stock to Hexagon, and is expected…
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Synopsys Reports Q3 2025 Results; Ansys Merger Drives Transformation and 2025 Outlook Synopsys, Inc. (Nasdaq: SNPS) reported its third quarter of fiscal year 2025 results with revenue of about $1.74 billion, up from $1.53 billion a year earlier. The company framed Q3 as a transformational quarter driven by the closing of the Ansys acquisition, expanding…