Cadence

  • Siemens Unveils AI-Enhanced EDA Toolset at DAC 2025

    Siemens Unveils AI-Enhanced EDA Toolset at DAC 2025

    At DAC 2025 in San Francisco, Siemens Digital Industries Software introduced an AI-enhanced EDA toolset designed to accelerate semiconductor and PCB design workflows. The centerpiece is a purpose-built EDA AI system that combines secure, generative and agentic AI with deep customization and seamless integration across the entire EDA flow. Siemens frames the system as a strategic investment to help design teams handle increasing complexity and bring breakthrough designs to market faster.

    The EDA AI system supports open, customizable workflows: customers can ingest their own EDA data, tailor AI-driven processes, and deploy AI where it adds the most value. Deployment is flexible (on-premises or cloud) with enterprise-grade security, robust access controls, and a centralized multimodal data lake that supports a range of AI models, from large language models to traditional ML and reinforcement learning.

    Siemens is leveraging NVIDIA technologies to accelerate EDA tasks, including NVIDIA NIM microservices for scalable inference across cloud and on-premises, and the Llama Nemotron for enhanced context reasoning and tool-calling. Industry perspectives from NVIDIA note that AI agents can significantly boost productivity across layout optimization, simulation, and verification.

    Key portfolio components highlighted include:
    – Aprisa AI: integrated into RTL-to-GDS flow, offering AI-driven design exploration, PPA optimization, and a 10x productivity boost, with 3x faster tapeout and around 10% better PPA.
    – Calibre Vision AI: chip-integration signoff with clustering, state bookmarks, and collaboration enhancements, integrated into existing layout viewers.
    – Solido: generative and agentic AI across the custom IC process from schematic to verification, enabling substantial productivity gains.

    Availability is currently in early access across Siemens EDA offerings, with more details on Siemens’ EDA AI pages.

  • Cadence to Acquire Hexagon’s Design & Engineering Unit to Boost Multiphysics System Design

    Cadence to Acquire Hexagon’s Design & Engineering Unit to Boost Multiphysics System Design

    Cadence Design Systems announced a definitive agreement to acquire the Design & Engineering (D&E) business of Hexagon AB, including MSC Software, for about €2.7 billion. The deal funds 70% in cash and 30% in Cadence common stock to Hexagon, and is expected to close in the first quarter of 2026, subject to regulatory approvals.

    The acquisition accelerates Cadence’s Intelligent System Design strategy by expanding its System Design & Analysis portfolio and strengthening its presence in structural analysis alongside its existing electromagnetics, electrothermal, and CFD capabilities. Hexagon D&E brings flagship multiphysics solvers, notably MSC Nastran and Adams, which are industry standards for structural and multibody dynamics simulation. These tools will augment Cadence’s capabilities and enable a unified, end-to-end multiphysics platform that supports earlier, more integrated analyses during the design cycle.

    This move enhances Cadence’s reach into aerospace, automotive, robotics, and industrial applications, complementing its Beta CAE acquisition from 2024. The combined solution set aims to drive convergence of electrical and mechanical design—supporting robotics, autonomous systems, physical AI, and electrified vehicle development. The deal also broadens Cadence’s customer base to major OEMs and Tier 1 suppliers including Volkswagen Group, BMW, Toyota, Lockheed Martin, BAE, and Boeing.

    Hexagon D&E generated about $280 million in revenue in 2024 and employs over 1,100 people across global sites, with strong R&D, sales, and support teams. The transaction signals Cadence’s push to offer comprehensive, converged simulation for tomorrow’s complex systems.