Insights:
- Synopsys and TSMC collaborate on cutting-edge multi-die AI chip designs using advanced EDA flows and IP solutions.
- The 3DIC Compiler platform supports TSMC’s 3D packaging technologies, enabling faster tape-outs and greater design productivity.
- Certified Synopsys digital and analog EDA tools are optimized for TSMC’s N2P, A16, and upcoming A14 processes.
- Synopsys delivers comprehensive IP portfolios supporting high-performance standards like HBM4, PCIe 7.0, and automotive-grade IP for TSMC’s advanced nodes.
- Collaboration extends into silicon photonics and advanced packaging technologies, enhancing multi-die integration and energy-efficient AI chip performance.
Synopsys continues to strengthen its partnership with TSMC to advance semiconductor innovation focused on AI and multi-die designs. Leveraging TSMC’s leading-edge processes such as N2P, A16, and future A14, Synopsys provides certified analog and digital EDA flows that optimize chip performance, power efficiency, and scalability. Their 3DIC Compiler platform supports complex 3D integration technologies like SoIC and CoWoS, enabling faster design cycles and improved productivity for multi-die chip solutions.
Additionally, Synopsys offers an extensive portfolio of IP solutions crafted for TSMC’s advanced nodes, including cutting-edge interfaces such as PCIe 7.0 and HBM4, as well as automotive-grade IP for safety-critical applications. This combined effort ensures that customers can deliver differentiated AI chips that meet stringent performance and reliability requirements while minimizing power consumption. Further collaboration in silicon photonics demonstrates their commitment to pushing the boundaries of system performance in multi-die and AI applications.
Through this ongoing partnership, Synopsys and TSMC enable semiconductor companies to accelerate time to market and push innovation in AI-driven and multi-die integrated circuit designs, making them key enablers of the next generation of advanced semiconductor technology.
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Synopsys, TSMC