Insights
- Keysight and Intel Foundry collaborate to advance EMIB-T technology for AI and data center chips.
- Adoption of open standards like UCIe™ 2.0 and BoW ensures seamless chiplet interoperability.
- Keysight’s Chiplet PHY Designer offers pre-silicon validation to streamline chiplet design and reduce risks.
- The partnership accelerates innovation by enabling faster, more reliable high-performance semiconductor packaging.
- Demonstrations of the new EMIB-T workflow are showcased at Intel Foundry Direct Connect event.
Keysight Technologies and Intel Foundry have announced a strategic collaboration to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a breakthrough packaging solution tailored for the demanding AI and data center markets. This partnership addresses the critical need for reliable, high-speed communication and efficient power delivery between chiplets and 3D integrated circuits, which are essential for next-generation semiconductor performance.
By leveraging emerging open standards such as Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Bunch of Wires (BoW), Keysight and Intel aim to create a robust chiplet interoperability ecosystem. Keysight’s Chiplet PHY Designer now integrates advanced simulation and validation capabilities aligned with these standards, offering engineers a streamlined, pre-silicon design verification process that reduces development costs and mitigates manufacturing risks.
This collaboration enhances chiplet design flexibility, empowering rapid innovation and ensuring customers can meet future workloads with precision. The advanced EMIB-T workflow will be showcased by Keysight at the Intel Foundry Direct Connect event, highlighting this pivotal step in semiconductor packaging technology.