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2025 OCP Global Summit San Jose, California October 13–16, 2025 Registration: https://www.opencompute.org/summit/global-summit/registration
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Insights: Cadence and TSMC advance AI and HPC chip design with AI-driven automation and IP. Support for TSMC’s latest process nodes including N3, N2, A16, and upcoming A14 PDK. Enhanced 3D-IC design productivity enabled by Cadence solutions integrated with TSMC’s 3DFabric. New silicon-proven IP such as HBM4, LPDDR6/5X, PCIe 7.0, and Universal Chiplet Interconnect for…
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Insights: Synopsys and GlobalFoundries have partnered to introduce a pioneering educational program aimed at equipping university students with practical experience in chip design and fabrication. This pilot initiative, launching at over 40 universities worldwide, provides students and professors with professional-grade electronic design automation (EDA) tools from Synopsys and access to manufacturing through GlobalFoundries’ multi-project wafer…
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Insights: Synopsys continues to strengthen its partnership with TSMC to advance semiconductor innovation focused on AI and multi-die designs. Leveraging TSMC’s leading-edge processes such as N2P, A16, and future A14, Synopsys provides certified analog and digital EDA flows that optimize chip performance, power efficiency, and scalability. Their 3DIC Compiler platform supports complex 3D integration technologies…
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Insights: Siemens Digital Industries Software has joined forces with Advanced Semiconductor Engineering, Inc. (ASE) to develop and validate 3Dblox-based workflows for ASE’s advanced VIPack™ platform. This collaboration targets key semiconductor packaging technologies, including Fanout Chip-on-Substrate (FOCoS), FOCoS-Bridge, and Through Silicon Via (TSV)-based 2.5D and 3D ICs. Siemens’ Innovator3D IC solution, fully certified for the 3Dblox…
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Insights: onsemi announced on September 22, 2025, that it has entered into an agreement to acquire rights and intellectual property related to Aura Semiconductor’s Vcore power technologies. This strategic acquisition is designed to enhance onsemi’s power management solutions, particularly for AI data centers. The integration of these technologies will enable onsemi to offer a more…
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Insights: Micron Technology, Inc. closed fiscal year 2025 with record-breaking financial performance, largely driven by strong demand for AI data center memory solutions. The company’s Q4 results reinforced its leadership position in technology and operational excellence, setting the stage for continued growth into fiscal 2026. With a portfolio of high-performance DRAM, NAND, and NOR products,…
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Insights: This week, the United Kingdom emerged as a global AI hub during NVIDIA CEO Jensen Huang’s visit, marked by a high-profile event in London featuring UK Prime Minister Keir Starmer and senior government officials. The gathering emphasized the UK’s unique “Goldilocks moment,” where top universities, researchers, startups, and venture capital converge to create fertile…
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Insights: NVIDIA and Intel have announced a groundbreaking collaboration to jointly develop next-generation custom datacenter and personal computing products that combine their technological expertise. This partnership will leverage NVIDIA’s powerful AI and accelerated computing platforms alongside Intel’s leading x86 CPUs and architecture. Intel plans to build NVIDIA-customized x86 CPUs specifically for integration into NVIDIA’s AI…
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Insights Cadence Design Systems has completed the acquisition of the Arm Artisan foundation IP business, a significant addition to its expanding suite of semiconductor design solutions. The acquired IP includes critical components such as standard cell libraries, memory compilers, and general-purpose I/Os—elements optimized for advanced semiconductor process nodes used by leading foundries. This strategic move…
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Insights Eliyan Corporation has announced a major breakthrough with the successful tape out of its NuLink PHY in a x64 UCIe Advanced Package Module, manufactured using Samsung Foundry’s cutting-edge SF4X 4nm process. This new chiplet interconnect technology boasts an impressive 40Gbps bandwidth at remarkably low power levels, achieving unprecedented power density through the use of…
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Insights Keysight Technologies and Intel Foundry have announced a strategic collaboration to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a breakthrough packaging solution tailored for the demanding AI and data center markets. This partnership addresses the critical need for reliable, high-speed communication and efficient power delivery between chiplets and 3D integrated circuits, which are essential…