Category: Cadence
-
Revolutionizing Engineering with Cadence and NVIDIA’s Agentic AI Collaboration
Insights: At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA aimed at transforming engineering productivity through the fusion of agentic AI, physics-based simulation, and digital twin technology. This collaboration targets faster and more efficient semiconductor design, physical AI systems, and hyperscale AI factories by integrating Cadence’s AI-driven EDA tools with NVIDIA’s CUDA-X
-
Cadence and TSMC Forge AI Chip Design Breakthroughs
Insights: Cadence and TSMC advance AI and HPC chip design with AI-driven automation and IP. Support for TSMC’s latest process nodes including N3, N2, A16, and upcoming A14 PDK. Enhanced 3D-IC design productivity enabled by Cadence solutions integrated with TSMC’s 3DFabric. New silicon-proven IP such as HBM4, LPDDR6/5X, PCIe 7.0, and Universal Chiplet Interconnect for