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Read more: Revolutionizing Engineering with Cadence and NVIDIA’s Agentic AI Collaboration

Revolutionizing Engineering with Cadence and NVIDIA’s Agentic AI Collaboration
Insights: At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA aimed at transforming engineering productivity through the fusion of agentic AI, physics-based simulation, and digital twin technology. This collaboration targets faster and more efficient semiconductor design, physical AI systems, and hyperscale AI factories…
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Read more: TSMC Unveils A13 Process: Next-Gen AI and HPC Silicon Innovation

TSMC Unveils A13 Process: Next-Gen AI and HPC Silicon Innovation
Insights: TSMC has unveiled its latest semiconductor process technology, the A13 node, at the 2026 North America Technology Symposium held in Santa Clara, California. This new process is a direct shrink of the previously announced A14 node, delivering a 6% reduction in chip area, which translates…
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Read more: Cadence and Google Team Up to Supercharge AI-Driven Chip Design with ChipStack on Google Cloud

Cadence and Google Team Up to Supercharge AI-Driven Chip Design with ChipStack on Google Cloud
Cadence and Google have announced a strategic collaboration to bring the ChipStack AI Super Agent — powered by Google’s Gemini models — to Google Cloud. Promising up to 10X productivity gains across chip design and verification workflows, this cloud-native, agent-driven platform could set a new benchmark…
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Read more: Accelerating the Digital Future: Siemens User2User 2026

Accelerating the Digital Future: Siemens User2User 2026
Accelerating the Digital Future: Siemens User2User 2026 The Siemens User2User 2026 conference has officially kicked off, bringing together the brightest minds in Electronic Design Automation (EDA) to tackle the “AI-driven, software-defined” era of silicon engineering. This year’s opening theme centers on “Enabling Imagination through Integrated System…
- Read more: CDNLIVE 2026
