Category: inc. (ase)
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Synopsys and GlobalFoundries launch a global pilot program offering a ‘chip design to tapeout’ curriculum to universities.
Insights: Synopsys and GlobalFoundries have partnered to introduce a pioneering educational program aimed at equipping university students with practical experience in chip design and fabrication. This pilot initiative, launching at over 40 universities worldwide, provides students and professors with professional-grade electronic design automation (EDA) tools from Synopsys and access to manufacturing through GlobalFoundries’ multi-project wafer
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Siemens and ASE Revolutionize 3D Semiconductor Packaging with Innovator3D IC
Insights: Siemens Digital Industries Software has joined forces with Advanced Semiconductor Engineering, Inc. (ASE) to develop and validate 3Dblox-based workflows for ASE’s advanced VIPack™ platform. This collaboration targets key semiconductor packaging technologies, including Fanout Chip-on-Substrate (FOCoS), FOCoS-Bridge, and Through Silicon Via (TSV)-based 2.5D and 3D ICs. Siemens’ Innovator3D IC solution, fully certified for the 3Dblox