Siemens Digital Industries Software has joined forces with Advanced Semiconductor Engineering, Inc. (ASE) to develop and validate 3Dblox-based workflows for ASE’s advanced VIPack™ platform. This collaboration targets key semiconductor packaging technologies, including Fanout Chip-on-Substrate (FOCoS), FOCoS-Bridge, and Through Silicon Via (TSV)-based 2.5D and 3D ICs. Siemens’ Innovator3D IC solution, fully certified for the 3Dblox standard, acts as a rapid design assembly exploration tool that fosters interoperability and streamlines the design process.

ASE’s VIPack platform, a next-generation heterogeneous integration architecture, supports comprehensive co-design across six core packaging pillars. It leverages advanced redistribution layer (RDL) processes and 3D technologies to achieve ultra-high density and superior performance by integrating multiple chips into one package. The collaboration enhances design flexibility and accelerates the time-to-market by allowing customers to quickly address complex packaging challenges with EDA tool compatibility.

The partnership also emphasizes System Technology Co-optimization (STCO) through hierarchical device planning, imperative for advanced chiplet-based heterogeneous integration. Both Siemens and ASE acknowledge their ongoing commitment to 3Dblox as a foundation for semiconductor package design that delivers open interoperability and innovation for future chip packaging solutions.

For more information visit

Siemens Digital Industries Software, Advanced Semiconductor Engineering, Inc. (ASE)